Seung-Mahn Lee

City:

Country:

United States

Published Applications:

Last publication date:

2007-08-23

Top Assignees for applications by Seung-Mahn Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Seung-Mahn:

Seung-Mahn Lee from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches

InventorID:

4475667 ⎘