Gyeonggi-do
South Korea
11
2026-05-28
The entities that hold a legal rights for patent applications filed by inventor Lee Hunteak:
Hunteak Lee from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
#2 | 2025-03-27Semiconductor Device and Method of Forming Fine-Pitch Interconnection Using Insulating Layer
#3 | 2025-01-16Antenna-in-Package Devices and Methods of Making
#4 | 2024-11-07Semiconductor Device and Method of Making a Multi-Tier System-in-Package
#5 | 2024-08-29SEMICONDUCTOR PACKAGE WITH IMPROVED SPACE UTILIZATION AND METHOD FOR MAKING THE SAME
#6 | 2023-05-04Antenna-in-package devices and methods of making
#7 | 2016-06-09Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#8 | 2015-01-01Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding
#9 | 2014-10-02Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding
#10 | 2014-06-26Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#11 | 2013-09-26Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape
451815 ⎘