Hiroki Ando

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-01-22

Top Assignees for applications by Hiroki Ando

The entities that hold a legal rights for patent applications filed by inventor Ando Hiroki:

Hiroki Ando from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE

THERMOPLASTIC RESIN COMPOSITION FOR FOAM MOLDING AND MOLDED FOAM ARTICLE THEREOF

THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN MOLDED ARTICLE, AND PAINTED PART

THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

THERMOPLASTIC RESIN COMPOSITION FOR FOAM MOLDING AND MOLDED FOAM ARTICLE THEREOF

DC TEST APPARATUS

Testing apparatus

Coaxial cable unit, test apparatus, and CPU system

InventorID:

4519331 ⎘