Taichung
Taiwan
21
2020-05-14
The entities that hold a legal rights for patent applications filed by inventor Chen Lu-Yi:
Lu-Yi Chen from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Fabrication method of semiconductor package with stacked semiconductor chips
#2 | 2019-02-21Method for fabricating electronic package
#3 | 2019-02-07Method for fabricating electronic package
#4 | 2018-09-13Fabrication method of semiconductor package with stacked semiconductor chips
#5 | 2018-09-06Electrical testing method of interposer
#6 | 2018-02-15Fabrication method of electronic package
#7 | 2018-02-08Electronic device
#8 | 2017-11-23Electronic package and method for fabricating the same
#9 | 2017-10-26Fabrication method of electronic module
#10 | 2017-05-25METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#11 | 2017-02-16Electronic package and fabrication method thereof
#12 | 2017-02-02Carrier structure, packaging substrate, electronic package and fabrication method thereof
#13 | 2017-01-05Electronic package and fabrication method thereof
#14 | 2016-11-03Substrate structure with first and second conductive bumps having different widths
#15 | 2016-08-11Package structure and fabrication method thereof
#16 | 2016-03-03Electronic module and fabrication method thereof
#17 | 2015-02-05SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#18 | 2015-02-05SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#19 | 2013-11-14Semiconductor package with stacked semiconductor chips
#20 | 2013-09-26Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate
#21 | 2013-09-26Interposer and electrical testing method thereof
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