Brian Taggert

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2006-01-19

Top Assignees for applications by Brian Taggert

The entities that hold a legal rights for patent applications filed by inventor Taggert Brian:

Brian Taggert from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

InventorID:

4553803 ⎘