Matthew A. Purdy

Method and apparatus for predicting yield parameters based on fault classification

Method and apparatus for modifying process selectivities based on process state information

Method and apparatus for controlling a film formation process with multiple objectives

Method and apparatus for selecting wafers for sampling

Method and apparatus for scheduling metrology based on a jeopardy count

Method and system for dynamically selecting wafer lots for metrology processing

Method and apparatus for calibrating degradable components using process state data

Method and apparatus for fault classification based on residual vectors

Method and apparatus for implementing competing control models

Controlling cumulative wafer effects

Adjusting weighting of a parameter relating to fault detection based on a detected fault

Methods of controlling optical properties of a capping insulating layer on memory devices, and system for performing same

Method and system for dynamically adjusting metrology sampling based upon available metrology capacity

Method and system for prioritizing material to clear exception conditions

Fault detection spanning multiple processes

Verifying a fault detection result based on a process control state

Matching data related to multiple metrology tools

Method of controlling stepper process parameters based upon optical properties of incoming anti-reflecting coating layers, and system for accomplishing same

Prioritizing an application of correction in a multi-input control system

Updating process controller based upon fault detection analysis

Dynamic metrology sampling methods, and system for performing same