Campbell, California
United States
8
2007-11-06
The entities that hold a legal rights for patent applications filed by inventor Cheng Peng:
Peng Cheng from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMS device integrated chip package, and method of making same
#2 | 2007-07-17Micro-electromechanical structure resonator frequency adjustment using radiant energy trimming and laser/focused ion beam assisted deposition
#3 | 2006-02-28Sacrificial layer technique to make gaps in MEMS applications
#4 | 2006-02-09Sacrificial layer technique to make gaps in MEMS applications
#5 | 2005-12-27Variable tunable range MEMS capacitor
#6 | 2005-05-10Fabrication of on-package and on-chip structure using build-up layer process
#7 | 2005-04-28High dielectric constant metal oxide gate dielectrics
#8 | 2005-02-17Vacuum-cavity MEMS resonator
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