Inventor profile of:

Steven E. Reder

City:

Boring, Oregon

Country:

United States

Published Applications:

16

Last publication date:

2013-07-04

Top Assignees for applications by Steven E. Reder

The entities that hold a legal rights for patent applications filed by inventor Reder Steven E.:

Recent patent applications by Reder Steven E.

Steven E. Reder from Boring, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-07-04
US20130167895A1
Electricity

Method for heat dissipation on semiconductor device

#2 | 2008-02-19
US10452360
-

Electroplating tool for semiconductor manufacture having electric field control

#3 | 2008-01-01
US10012821
-

Reactor system

#4 | 2006-10-05
US20060219572A1
Performing operations; transporting

Abrasive Electrolyte

#5 | 2006-08-24
US20060185986A1
Chemistry; metallurgy

Method to improve the control of electro-polishing by use of a plating electrode in an electrolyte bath

#6 | 2006-03-02
US20060043582A1
Electricity

Method for heat dissipation on semiconductor device

#7 | 2006-01-03
US10679004
-

Mechanism for improving the structural integrity of low-k films

#8 | 2005-11-24
US20050258044A1
Electricity

Magnetic focus rings for improved copper plating

#9 | 2005-08-18
US20050181706A1
Performing operations; transporting

Method and control system for improving CMP process by detecting and reacting to harmonic oscillation

#10 | 2005-05-26
US20050110512A1
Chemistry; metallurgy

Contact resistance device for improved process control

#11 | 2005-04-28
US20050090121A1
Chemistry; metallurgy

Chemical mechanical electropolishing system

#12 | 2005-04-28
US20050087451A1
Performing operations; transporting

Abrasive electrolyte

#13 | 2005-04-28
US20050087450A1
Chemistry; metallurgy

Electropolishing pad

#14 | 2005-02-17
US20050037620A1
Electricity

Method for achieving wafer contact for electro-processing

#15 | 2005-02-10
US20050029122A1
Chemistry; metallurgy

Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath

#16 | 2005-01-04
US10290437
-

Method and apparatus for cleaning deposited films from the edge of a wafer

InventorID:

4579554 ⎘