Murphy, Texas
United States
13
2016-02-11
The entities that hold a legal rights for patent applications filed by inventor Diep Buu:
Buu Diep from Murphy, US has applied for patents for these inventions. The list has both pending applications and granted patents:
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
#2 | 2015-09-03Getter structure and method for forming such structure
#3 | 2015-06-11Method of forming deposited patterns on a surface
#4 | 2014-11-27Integrated bondline spacers for wafer level packaged circuit devices
#5 | 2014-07-10Integrated bondline spacers for wafer level packaged circuit devices
#6 | 2014-06-26GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE
#7 | 2014-05-08Integrated bondline spacers for wafer level packaged circuit devices
#8 | 2013-12-26Fabrication of window cavity cap structures in wafer level packaging
#9 | 2013-10-03Disposable bond gap control structures
#10 | 2012-05-10Reducing formation of oxide on solder
#11 | 2012-05-10Disposable bond gap control structures
#12 | 2012-04-26System and method for packaging electronic devices
#13 | 2012-04-26Incident radiation detector packaging
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