Esslingen
Germany
24
2018-07-26
The entities that hold a legal rights for patent applications filed by inventor Reichenbach Ralf:
Ralf Reichenbach from Esslingen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR MANUFACTURING A MICROELECTRONIC MEDIA SENSOR ASSEMBLY, AND MICROELECTRONIC MEDIA SENSOR ASSEMBLY
#2 | 2017-04-06MEMS element including a stress decoupling structure and a component including such a MEMS element
#3 | 2017-03-23INTERPOSER FOR MOUNTING A VERTICALLY INTEGRATED HYBRID COMPONENT ON A COMPONENT CARRIER
#4 | 2015-12-10Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements
#5 | 2015-12-10Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure
#6 | 2013-10-03Multifunction sensor as PoP microwave PCB
#7 | 2012-11-08Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
#8 | 2012-05-31METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A CORRESPONDING SEMICONDUCTOR STRUCTURE
#9 | 2011-12-08Piezoelectric generator
#10 | 2011-11-17Method for manufacturing porous microstructures, porous microstructures manufactured according to this method, and the use thereof
#11 | 2011-10-13Method for manufacturing at least one mechanical-electrical energy conversion system
#12 | 2011-07-21Multiaxial micromechanical acceleration sensor
#13 | 2011-07-14Microvalve, micropump and manufacturing method
#14 | 2011-02-10Method for manufacturing a micropump and micropump
#15 | 2010-07-01Microdosing Device for Dosing of Smallest Quantities of a Medium
#16 | 2010-02-11Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
#17 | 2010-02-11Bending transducer for generating electrical energy from mechanical deformations
#18 | 2010-01-14Method for Treating a Material Having Nanoscale Pores
#19 | 2010-01-14Bending transducer device for generating electrical energy from deformations and circuit module
#20 | 2009-09-24Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure
#21 | 2009-08-20Circuit module
#22 | 2009-08-20Circuit module
#23 | 2009-01-01Method for Depositing an Anti-Adhesion Layer
#24 | 2008-02-28Method for manufacturing an at least partially porous, hollow silicon body, hollow silicon bodies manufacturable by this method, and uses of these hollow silicon bodies
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