Timothy M. Takeuchi

City:

Tempe, Arizona

Country:

United States

Published Applications:

Last publication date:

2006-06-01

Top Assignees for applications by Timothy M. Takeuchi

The entities that hold a legal rights for patent applications filed by inventor Takeuchi Timothy M.:

Timothy M. Takeuchi from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core

Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core

InventorID:

4634104 ⎘