Jason Price

City:

Eugene, Oregon

Country:

United States

Published Applications:

Last publication date:

2006-06-15

Top Assignees for applications by Jason Price

The entities that hold a legal rights for patent applications filed by inventor Price Jason:

Jason Price from Eugene, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

InventorID:

4644340 ⎘