Inventor profile of:

Christopher David Muzzy

City:

Burlington, Vermont

Country:

United States

Published Applications:

24

Last publication date:

2013-10-03

Top Assignees for applications by Christopher David Muzzy

The entities that hold a legal rights for patent applications filed by inventor Muzzy Christopher David:

Recent patent applications by Muzzy Christopher David

Christopher David Muzzy from Burlington, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-03
US20130258765A1
Physics

Method of changing reflectance or resistance of a region in an optoelectronic memory device

#2 | 2012-11-15
US20120287707A1
Physics

OPTOELECTRONIC MEMORY DEVICES

#3 | 2012-10-04
US20120248604A1
Electricity

Selective electromigration improvement for high current C4s

#4 | 2012-09-27
US20120241916A1
Electricity

Wafer edge conditioning for thinned wafers

#5 | 2011-05-05
US20110100685A1
Electricity

Substrate anchor structure and method

#6 | 2011-03-31
US20110072656A1
Electricity

Method for forming a current distribution structure

#7 | 2010-11-18
US20100290264A1
Physics

Optoelectronic memory devices

#8 | 2010-08-12
US20100203685A1
Electricity

Semiconductor chips with reduced stress from underfill at edge of chip

#9 | 2010-08-12
US20100203655A1
Electricity

Gap capacitors for monitoring stress in solder balls in flip chip technology

#10 | 2009-10-15
US20090256257A1
Electricity

Final via structures for bond pad-solder ball interconnections

#11 | 2009-08-13
US20090201626A1
Electricity

Gap capacitors for monitoring stress in solder balls in flip chip technology

#12 | 2009-05-21
US20090130599A1
Electricity

Method for forming an electrical structure comprising multiple photosensitive materials

#13 | 2009-04-30
US20090110881A1
Electricity

Substrate anchor structure and method

#14 | 2009-04-16
US20090095519A1
Electricity

Current distribution structure and method

#15 | 2009-03-12
US20090065925A1
Electricity

Dual-sided chip attached modules

#16 | 2009-02-05
US20090032929A1
Electricity

Semiconductor chips with reduced stress from underfill at edge of chip

#17 | 2008-03-20
US20080067676A1
Electricity

Electrical interconnection structure formation

#18 | 2007-11-22
US20070267746A1
Electricity

Dual-sided chip attached modules

#19 | 2007-08-30
US20070200229A1
Electricity

Chip underfill in flip-chip technologies

#20 | 2007-08-02
US20070176288A1
Electricity

Solder wall structure in flip-chip technologies

#21 | 2007-05-10
US20070105359A1
Electricity

Electrical interconnection structure formation

#22 | 2007-01-18
US20070013071A1
Electricity

Probing pads in kerf area for wafer testing

#23 | 2006-11-02
US20060246703A1
Electricity

Post bump passivation for soft error protection

#24 | 2006-04-13
US20060076677A1
Electricity

Resist sidewall spacer for C4 BLM undercut control

InventorID:

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