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Inventor profile of:

Hiroki Ohno

City:

Nirasaki-shi

Country:

Japan

Published Applications:

Last publication date:

2014-09-11

Top Assignees for applications by Hiroki Ohno

The entities that hold a legal rights for patent applications filed by inventor Ohno Hiroki:

TOKYO ELECTRON LIMITED 7 Tokyo, Japan
Kabushiki Kaisha Toshiba 2 Tokyo, Japan
TOKYO ELECTRON LIMITED 2 Minato-ku, Japan
Toshiba Memory Corporation 2 Minato-ku, Japan
Kabushiki Kaisha Toshiba 1 Minato-ku, Japan
TOKYO ELECTRON LIMITED 1 Tokyo-To, Japan

Recent patent applications by Ohno Hiroki

Hiroki Ohno from Nirasaki-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-09-11

US20140250714A1

Electricity

Supercritical drying method for semiconductor substrate and supercritical drying apparatus

#2 | 2014-01-23

US20140020721A1

Electricity

Substrate processing method and storage medium

#3 | 2013-01-24

US20130019905A1

Electricity

Supercritical drying method for semiconductor substrate and supercritical drying apparatus

#4 | 2012-12-06

US20120304485A1

Electricity

Substrate processing method, substrate processing apparatus, and storage medium

#5 | 2012-10-04

US20120247516A1

Mechanical engineering

Supercritical drying method and apparatus for semiconductor substrates

#6 | 2010-12-09

US20100307543A1

Electricity

Substrate processing method and substrate processing apparatus

#7 | 2008-06-05

US20080127508A1

Electricity

Substrate processing apparatus and substrate processing method

#8 | 2008-02-21

US20080041420A1

Electricity

Substrate cleaning method and computer readable storage medium

#9 | 2007-06-07

US20070125405A1

Electricity

Substrate cleaning method and substrate cleaning apparatus

#10 | 2007-01-25

US20070017555A1

Electricity

Substrate processing method and substrate processing apparatus

#11 | 2005-02-03

US20050026454A1

Electricity

Film forming method and film forming apparatus

InventorID:

46749 ⎘