Chandler, Arizona
United States
11
2017-08-10
The entities that hold a legal rights for patent applications filed by inventor Razdan Sandeep:
Sandeep Razdan from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Interconnect structures with polymer core
#2 | 2017-02-09FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
#3 | 2017-02-02Methods and devices for securing and transporting singulated die in high volume manufacturing
#4 | 2016-06-16Methods and devices for securing and transporting singulated die in high volume manufacturing
#5 | 2015-07-02Methods and devices for securing and transporting singulated die in high volume manufacturing
#6 | 2015-06-11Interconnect structures with polymer core
#7 | 2014-09-18Interconnect structures with polymer core
#8 | 2014-03-06Techniques and configurations for surface treatment of an integrated circuit substrate
#9 | 2013-10-10Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
#10 | 2011-06-30Flip chip package containing novel underfill materials
#11 | 2010-06-24Protective coating for semiconductor substrates
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