Raleigh, North Carolina
United States
29
2021-11-25
The entities that hold a legal rights for patent applications filed by inventor Bergmann Michael John:
Michael John Bergmann from Raleigh, US has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A SINGLE CARRIER DIE
#2 | 2021-04-08Wafer level packaging of light emitting diodes (LEDs)
#3 | 2021-01-21High voltage monolithic LED chip
#4 | 2019-03-07High voltage monolithic LED chip
#5 | 2018-11-15Solid-state lamp with LED filaments having different CCT's
#6 | 2018-04-19Light-emitting devices having closely-spaced broad-spectrum and narrow-spectrum luminescent materials and related methods
#7 | 2018-01-11Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters
#8 | 2017-10-26High voltage monolithic LED chip
#9 | 2017-09-21WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A SINGLE CARRIER DIE
#10 | 2017-08-10Wafer level packaging of light emitting diodes (LEDs)
#11 | 2017-06-08Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters
#12 | 2017-06-01Light emitting diode (LED) components including multiple LED dies that are attached to lead frames
#13 | 2017-04-06Low optical loss flip chip solid state lighting device
#14 | 2017-02-02Small form-factor LED lamp with color-controlled dimming
#15 | 2016-12-22Light emitting devices having closely-spaced broad-spectrum and narrow-spectrum luminescent materials and related methods
#16 | 2016-09-22LED lamp with refracting optic element
#17 | 2016-09-01NON-MAGNIFIED LED FOR HIGH CENTER-BEAM CANDLE POWER
#18 | 2016-06-09LED based candelabra lamp
#19 | 2016-05-26Light emitting diode (LED) components including LED dies that are directly attached to lead frames
#20 | 2015-08-06SOLID STATE LIGHTING DEVICE WITH REDUCED LUMINOUS FLUX DROP AT ELEVATED TEMPERATURE
#21 | 2014-10-02Compact LED package with reflectivity layer
#22 | 2014-08-07Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction Temperature
#23 | 2014-06-19Enhanced Luminous Flux Semiconductor Light Emitting Devices Including Red Phosphors that Exhibit Good Color Rendering Properties and Related Red Phosphors
#24 | 2014-03-13High voltage monolithic LED chip
#25 | 2014-01-30LED package with encapsulant having curved and planar surfaces
#26 | 2013-12-26Group III nitride based quantum well light emitting device structures with an indium containing capping structure
#27 | 2013-11-07Light emitting devices having current reducing structures
#28 | 2013-10-10Wafer level packaging of multiple light emitting diodes (LEDs) on a single carrier die
#29 | 2013-10-10Wafer level packaging of light emitting diodes (LEDs)
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