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Inventor profile of:

Sebastian Schmidt

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2013-10-10

Top Assignees for applications by Sebastian Schmidt

The entities that hold a legal rights for patent applications filed by inventor Schmidt Sebastian:

Infineon Technologies AG 8 Munich, Germany
INFINEON TECHNOLOGIES AG 5 Neubiberg, Germany
MOTOROLA, INC. 1 Schaumburg, IL United States
United Microelectronics Co. 1 , Taiwan
United Microelectronics Co. 1 Hsin-Chu, Taiwan
Infineon Technologies SC300 GmbH & Co., KG 1 Dresden, Germany
Infineon Technologies AG 1 , Germany
Infineon Technologies North America Corp. 1 San Jose, CA United States

Recent patent applications by Schmidt Sebastian

Sebastian Schmidt from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-10

US20130267048A1

Electricity

Structure and method for placement, sizing and shaping of dummy structures

#2 | 2011-06-09

US20110133304A1

Electricity

Structure and Method for Placement, Sizing and Shaping of Dummy Structures

#3 | 2010-12-23

US20100321656A1

Physics

Transmission mask with differential attenuation to improve ISO-dense proximity

#4 | 2009-05-14

US20090124027A1

Electricity

Structure and method for placement, sizing and shaping of dummy structures

#5 | 2006-09-28

US20060216905A1

Electricity

Structure and method for placement, sizing and shaping of dummy structures

#6 | 2006-05-30

US10364664

Transmission mask with differential attenuation to improve ISO-dense proximity

#7 | 2006-05-04

US20060093971A1

Physics

Transmission mask with differential attenuation to improve ISO-dense proximity

#8 | 2006-04-20

US20060082748A1

Physics

Exposure device for immersion lithography and method for monitoring parameters of an exposure device for immersion lithography

#9 | 2005-12-27

US10802728

Method for measuring a characteristic dimension of at least one pattern on a disc-shaped object in a measuring instrument

#10 | 2005-12-27

US10635583

Method for exposing at least one or at least two semiconductor wafers

#11 | 2005-12-08

US20050269748A1

Physics

Method for purging an optical lens

#12 | 2005-06-21

US10713690

Method for performing an alignment measurement of two patterns in different layers on a semiconductor wafer

#13 | 2005-05-10

US10694594

Method for adjusting processing parameters of at least one plate-shaped object in a processing tool

#14 | 2005-03-24

US20050064634A1

Electricity

Structure and method for placement, sizing and shaping of dummy structures

InventorID:

477586 ⎘