Thomas A. Boyd

City:

North Plains, Oregon

Country:

United States

Published Applications:

Last publication date:

2019-02-14

Top Assignees for applications by Thomas A. Boyd

The entities that hold a legal rights for patent applications filed by inventor Boyd Thomas A.:

INTEL CORPORATION 9 Santa Clara, CA United States

Recent patent applications by Boyd Thomas A.

Thomas A. Boyd from North Plains, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-02-14

US20190052016A1

Electricity

Connector for processor package

#2 | 2018-06-14

US20180166807A1

Electricity

Connector port frame for processor package

#3 | 2017-06-29

US20170187134A1

Electricity

Linear edge connector with activator bar and contact load spring

#4 | 2017-06-29

US20170186661A1

Electricity

Rework grid array interposer with direct power

#5 | 2017-06-22

US20170179067A1

Electricity

Semiconductor package alignment frame for local reflow

#6 | 2017-06-22

US20170179066A1

Electricity

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

#7 | 2016-04-14

US20160106003A1

Electricity

Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

#8 | 2016-04-14

US20160105974A1

Electricity

Method for installing integrated circuit devices on a substrate

#9 | 2014-04-03

US20140092547A1

Electricity

Integrated assembly for installing integrated circuit devices on a substrate

#10 | 2013-10-17

US20130270691A1

Electricity

Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

InventorID:

483064 ⎘