Phoenix, Arizona
United States
167
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Sankman Robert L.:
Robert L. Sankman from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#2 | 2026-01-22MULTI-CHIP PACKAGING
#3 | 2026-01-15MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#4 | 2025-12-25ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#5 | 2025-07-10ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE SUBSTRATES
#6 | 2025-04-10PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
#7 | 2025-01-23MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
#8 | 2024-10-03MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#9 | 2024-07-11GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS
#10 | 2024-04-18MULTI-CHIP PACKAGING
#11 | 2024-04-18EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
#12 | 2024-03-14SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTURE AND METHOD OF MAKING
#13 | 2024-02-22ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE SUBSTRATES
#14 | 2024-01-25ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#15 | 2023-12-28PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES
#16 | 2023-12-28Inorganic-based embedded-die layers for modular semiconductive devices
#17 | 2023-12-28INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER
#18 | 2023-08-17Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making
#19 | 2023-05-25STACKED MAGNETIC INDUCTOR AND METHOD
#20 | 2023-05-04ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#21 | 2022-10-27ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
#22 | 2022-10-20EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#23 | 2022-09-15CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
#24 | 2022-08-115G mmWAVE COOLING THROUGH PCB
#25 | 2022-07-28Stacked die cavity package
#26 | 2022-07-21Multi-chip packaging
#27 | 2022-07-21Microelectronic device with embedded die substrate on interposer
#28 | 2022-07-07Antenna package using ball attach array to connect antenna and base substrates
#29 | 2022-06-02EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#30 | 2022-05-19Multi-chip packaging
#31 | 2022-05-19PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
#32 | 2022-05-05Distributed semiconductor die and package architecture
#33 | 2022-04-07Microelectronic device with embedded die substrate on interposer
#34 | 2022-03-31High performance integrated RF passives using dual lithography process
#35 | 2022-03-03PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES
#36 | 2022-01-27Inorganic-based embedded-die layers for modular semiconductive devices
#37 | 2021-12-23Thermal spreading management of 3D stacked integrated circuits
#38 | 2021-12-09Hybrid microelectronic substrates
#39 | 2021-09-30Embedded die architecture and method of making
#40 | 2021-08-19Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
#41 | 2021-06-24Full package vapor chamber with IHS
#42 | 2021-06-24Embedded die architecture and method of making
#43 | 2021-02-11Signal routing carrier
#44 | 2021-02-11Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making
#45 | 2021-02-04Multi-die ultrafine pitch patch architecture and method of making
#46 | 2021-01-28Scalable high speed high bandwidth IO signaling package architecture and method of making
#47 | 2021-01-28Glass core patch with in situ fabricated fan-out layer to enable die tiling applications
#48 | 2020-12-17Multi-chip packaging
#49 | 2020-12-17SUBSTRATELESS DOUBLE-SIDED EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
#50 | 2020-12-10Thermal spreading management of 3D stacked integrated circuits
#51 | 2020-12-10Pseudo-stripline using double solder-resist structure
#52 | 2020-10-22Hybrid microelectronic substrate and methods for fabricating the same
#53 | 2020-10-01Distributed semiconductor die and package architecture
#54 | 2020-10-01Inorganic-based embedded-die layers for modular semiconductive devices
#55 | 2020-09-24Antenna package using ball attach array to connect antenna and base substrates
#56 | 2020-09-24Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
#57 | 2020-08-27Ultra-thin, hyper-density semiconductor packages
#58 | 2020-08-27Stacked silicon die architecture with mixed flipcip and wirebond interconnect
#59 | 2020-08-27Embedded semiconductive chips in reconstituted wafers, and systems containing same
#60 | 2020-07-30In-package 3D antenna
#61 | 2020-07-23Planar integrated circuit package interconnects
#62 | 2020-06-11Stacked die cavity package
#63 | 2020-03-26STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CHIP DIE ON A SEMICONDUCTOR PACKAGE SUBSTRATE
#64 | 2019-12-125G mmWave cooling through PCB
#65 | 2019-12-05Multi-chip packaging
#66 | 2019-11-28Integrated circuit package supports
#67 | 2019-11-07Microelectronic device with embedded die substrate on interposer
#68 | 2019-08-29Multi-chip packages and sinterable paste for use with thermal interface materials
#69 | 2019-07-18Distributed semiconductor die and package architecture
#70 | 2019-06-27Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
#71 | 2019-06-06High density package interconnects
#72 | 2019-05-16Microelectronic bond pads having integrated spring structures
#73 | 2019-04-04Thermally coupled package-on-package semiconductor packages
#74 | 2019-02-21Hybrid microelectronic substrate and methods for fabricating the same
#75 | 2019-02-21Hybrid microelectronic substrates
#76 | 2019-02-07FLEXIBLE CIRCUIT INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME
#77 | 2018-12-27Chip-to-chip interconnect with embedded electro-optical bridge structures
#78 | 2018-12-25Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
#79 | 2018-12-06Electronic package that includes lamination layer
#80 | 2018-11-29Hybrid microelectronic substrate and methods for fabricating the same
#81 | 2018-11-01High performance integrated RF passives using dual lithography process
#82 | 2018-10-18Conductive base embedded interconnect
#83 | 2018-09-13FLEXIBLE ELECTRONIC ASSEMBLY METHOD
#84 | 2018-09-13SHIELDING MOLD FOR ELECTRIC AND MAGNETIC EMI MITIGATION
#85 | 2018-08-09Integrated circuit structures with recessed conductive contacts for package on package
#86 | 2018-08-09Multi-die package
#87 | 2018-06-28High density package interconnects
#88 | 2018-05-24Torque controlled driver apparatus and method
#89 | 2018-04-05HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSEMBLY MONOLAYER ASSISTED LASER DIRECT STRUCTURING PROCESS ON MOLD COMPOUND
#90 | 2018-03-29Package on Package Structure Having Package To Package Interconnect Composed of Packed Wires Having A Polygon Cross Section
#91 | 2018-03-08ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
#92 | 2018-02-01Embedded semiconductive chips in reconstituted wafers, and systems containing same
#93 | 2018-01-04Planar integrated circuit package interconnects
#94 | 2017-10-26Microelectronic bond pads having integrated spring structures
#95 | 2017-10-19Cloaking system with waveguides
#96 | 2017-10-05ELECTRICAL CABLE
#97 | 2017-10-05INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD
#98 | 2017-09-21Inflatable Bladder Based Mechanical Testing for Stretchable Electronics
#99 | 2017-09-21Lateral Expansion Apparatus for Mechanical Testing of Stretchable Electronics
#100 | 2017-09-21Membrane test for mechanical testing of stretchable electronics
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