Eric G. Webb

City:

Salem, Oregon

Country:

United States

Published Applications:

Last publication date:

2011-03-01

Top Assignees for applications by Eric G. Webb

The entities that hold a legal rights for patent applications filed by inventor Webb Eric G.:

Eric G. Webb from Salem, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Electroless layer plating process and apparatus

Anneal of ruthenium seed layer to improve copper plating

Electroplating bath containing wetting agent for defect reduction

Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

Electroplating using DC current interruption and variable rotation rate

InventorID:

4838301 ⎘