Robert M. Nickerson

THROUGH MOLD INTERCONNECT DRILL FEATURE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE

THROUGH MOLD INTERCONNECT DRILL FEATURE

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE

Offset interposers for large-bottom packages and large-die package-on-package structures

THROUGH MOLD INTERCONNECT DRILL FEATURE

Offset interposers for large-bottom packages and large-die package-on-package structures

Offset interposers for large-bottom packages and large-die package-on-package structures

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL

Through mold interconnect drill feature

Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone

Package on package thermal transfer systems and methods

Thermally coupled package-on-package semiconductor packages

Package on package thermal transfer systems and methods

Architecture material and process to improve thermal performance of the embedded die package

Interconnect structures with polymer core

Offset interposers for large-bottom packages and large-die package-on-package structures

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES

Pad-less interconnect for electrical coreless substrate

BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility

Interconnect structures with polymer core

Interconnect structures with polymer core

BBUL TOP SIDE SUBSTRATE LAYER ENABLING DUAL SIDED SILICON INTERCONNECT AND STACKING FLEXIBILITY

PACKAGE-ON-PACKAGE INTERCONNECT STIFFENER

Offset interposers for large-bottom packages and large-die package-on-package structures

Microelectronic package and method of manufacturing same

Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages

Package-on-package interconnect stiffener

HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES

Integrated circuit device mounting with folded substrate and interposer

Packaging logic and memory integrated circuits

Power distribution within a folded flex package method and apparatus

Folded substrate with interposer package for integrated circuit devices

Microelectronic assembly having a redistribution conductor over a microelectronic die

Lower profile flexible substrate package for electronic components