Naperville, Illinois
United States
10
2008-06-03
The entities that hold a legal rights for patent applications filed by inventor Wang Shumin:
Shumin Wang from Naperville, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Chemical mechanical polishing slurry useful for copper substrates
#2 | 2006-05-16Coated metal oxide particles for CMP
#3 | 2006-04-04Method of polishing a substrate with a polishing system containing conducting polymer
#4 | 2006-01-10Compositions for oxide CMP
#5 | 2005-12-20Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
#6 | 2005-07-07Chemical mechanical polishing systems and methods for their use
#7 | 2005-03-15Method of polishing a multi-layer substrate
#8 | 2005-02-15Polishing system with stopping compound and method of its use
#9 | 2005-02-08Method of polishing a multi-layer substrate
#10 | 2005-01-11Chemical mechanical polishing systems and methods for their use
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