Naperville, Illinois
United States
25
2017-02-09
The entities that hold a legal rights for patent applications filed by inventor Prasad Abaneshwar:
Abaneshwar Prasad from Naperville, US has applied for patents for these inventions. The list has both pending applications and granted patents:
CMP POLISHING PAD WITH COLUMNAR STRUCTURE AND METHODS RELATED THERETO
#2 | 2013-10-17Polishing pad with light-stable light-transmitting region
#3 | 2008-11-06STACKED POLISHING PAD FOR HIGH TEMPERATURE APPLICATIONS
#4 | 2008-10-14Transparent microporous materials for CMP
#5 | 2008-03-06Method for manufacturing microporous CMP materials having controlled pore size
#6 | 2007-08-09CMP porous pad with component-filled pores
#7 | 2006-12-21Polishing pad comprising magnetically sensitive particles and method for the use thereof
#8 | 2006-09-07Method of preparing a conductive film
#9 | 2006-03-09Method for manufacturing microporous CMP materials having controlled pore size
#10 | 2006-03-02Polishing pad with microporous regions
#11 | 2006-02-14Polishing pad with oriented pore structure
#12 | 2005-12-15Transparent microporous materials for CMP
#13 | 2005-11-01CMP pad with composite transparent window
#14 | 2005-09-29Low surface energy CMP pad
#15 | 2005-09-29CMP porous pad with component-filled pores
#16 | 2005-09-29Polishing pad comprising hydrophobic region and endpoint detection port
#17 | 2005-09-08Multi-layer polishing pad material for CMP
#18 | 2005-08-30Microporous polishing pads
#19 | 2005-07-14Negative poisson's ratio material-containing CMP polishing pad
#20 | 2005-07-05Microporous polishing pads
#21 | 2005-05-31Microporous polishing pads
#22 | 2005-05-24Microporous polishing pads
#23 | 2005-05-12Polishing pad comprising biodegradable polymer
#24 | 2005-05-12Polishing pad comprising biodegradable polymer
#25 | 2005-04-26Multi-layer polishing pad material for CMP
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