Lee John Smith

City:

Chandler, Arizona

Country:

United States

Published Applications:

Last publication date:

2011-09-13

Top Assignees for applications by Lee John Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Lee John:

Lee John Smith from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Thin substrate fabrication method and structure

Ultra thin package and fabrication method

Thin semiconductor package including stacked dies

InventorID:

4880155 ⎘