Kim L. Phillippe

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2005-07-21

Top Assignees for applications by Kim L. Phillippe

The entities that hold a legal rights for patent applications filed by inventor Phillippe Kim L.:

Kim L. Phillippe from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

InventorID:

4880744 ⎘