Tim Renfro

City:

Mesa, Arizona

Country:

United States

Published Applications:

Last publication date:

2005-09-29

Top Assignees for applications by Tim Renfro

The entities that hold a legal rights for patent applications filed by inventor Renfro Tim:

Tim Renfro from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Metallic solder thermal interface material layer and application of the same

Socket for having the same conductor inserts for signal, power and ground

InventorID:

4897327 ⎘