Inventor profile of:

Michael Weber

City:

Mainburg

Country:

Germany

Published Applications:

17

Last publication date:

2025-10-30

Top Assignees for applications by Michael Weber

The entities that hold a legal rights for patent applications filed by inventor Weber Michael:

Recent patent applications by Weber Michael

Michael Weber from Mainburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-30
US20250333294A1
Performing operations; transporting

DEVICE INCLUDING MEMS SENSOR AND METHOD OF MANUFACTURING THE SAME

#2 | 2023-02-09
US20230041154A1
Physics

SYSTEMS AND DEVICES FOR WHEEL SENSORS

#3 | 2021-10-07
US20210310890A1
Physics

Pressure sensor devices and methods for manufacturing pressure sensor devices

#4 | 2020-10-29
US20200341023A1
Physics

Magnetic-field sensor package with integrated passive component

#5 | 2019-04-18
US20190113412A1
Physics

Pressure sensor devices and methods for manufacturing pressure sensor devices

#6 | 2018-12-06
US20180350727A1
Electricity

Package with component connected at carrier level

#7 | 2013-10-24
US20130278246A1
Electricity

Bias field generator including a body having two body parts and holding a packaged magnetic sensor

#8 | 2011-06-23
US20110147930A1
Electricity

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

#9 | 2007-09-11
US10795344
-

Electronic device with cavity and a method for producing the same

#10 | 2007-04-26
US20070090535A1
Electricity

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

#11 | 2006-10-19
US20060234476A1
Performing operations; transporting

Electronic component and method for its production

#12 | 2006-08-24
US20060186525A1
Electricity

Electronic component with stacked semiconductor chips and method for producing the same

#13 | 2006-06-13
US10723998
-

Electronic component and method for its production

#14 | 2006-05-02
US10679170
-

Method for manufacturing a housing for a chip having a micromechanical structure

#15 | 2006-01-19
US20060014326A1
Electricity

Method for fabricating a semiconductor component with contacts situated at the underside

#16 | 2005-07-14
US20050151246A1
Electricity

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

#17 | 2005-01-27
US20050017374A1
Electricity

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

InventorID:

494133 ⎘