Munich
Germany
47
2021-10-14
The entities that hold a legal rights for patent applications filed by inventor Stecher Matthias:
Matthias Stecher from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Device comprising two voltage domains and method
#2 | 2018-10-18Semiconductor device with multi-layer metallization
#3 | 2018-08-02Semiconductor devices and methods for forming semiconductor devices
#4 | 2018-06-14Semiconductor device, electronic component and method
#5 | 2016-12-22Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor devices
#6 | 2016-11-24Vertical transistor with improved robustness
#7 | 2016-09-29Electronic device and method for production
#8 | 2016-08-04Method of triggering avalanche breakdown in a semiconductor device
#9 | 2016-06-23Semiconductor device with multi-layer metallization
#10 | 2016-03-03Method for producing a conductor line
#11 | 2015-09-10Semiconductor structure including guard ring
#12 | 2015-09-03Integrated circuit having an ESD protection structure and photon source
#13 | 2015-08-27Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor devices
#14 | 2015-03-12Semiconductor component and method of triggering avalanche breakdown
#15 | 2014-09-25Integrated semiconductor device having an insulating structure and a manufacturing method
#16 | 2014-09-11Semiconductor component comprising copper metallizations
#17 | 2014-03-06Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor devices
#18 | 2014-02-13Semiconductor component comprising copper metallizations
#19 | 2013-12-12Electronic device and method for production
#20 | 2013-10-24Method for producing a conductor line
#21 | 2013-10-24Semiconductor component with coreless transformer
#22 | 2013-03-28Semiconductor structure including guard ring
#23 | 2013-01-31Vertical transistor with improved robustness
#24 | 2012-07-12Integrated circuit and production method
#25 | 2012-07-12Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor devices
#26 | 2012-03-15Apparatus and method configured to lower thermal stresses
#27 | 2012-02-02Electronic device and method for production
#28 | 2011-12-29Semiconductor device and manufacturing method
#29 | 2011-12-22Integrated semiconductor device having an insulating structure and a manufacturing method
#30 | 2011-04-28Semiconductor device and method
#31 | 2011-04-21Apparatus and method configured to lower thermal stresses
#32 | 2010-10-21Semiconductor device and manufacturing method
#33 | 2010-08-26Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#34 | 2009-08-20Semiconductor device and method
#35 | 2009-07-16Semiconductor component and method for producing the same
#36 | 2009-05-07Power device
#37 | 2009-04-30Apparatus and method configured to lower thermal stresses
#38 | 2009-04-02Semiconductor component comprising copper metallizations
#39 | 2009-03-26Semiconductor Device with Multi-Layer Metallization
#40 | 2008-10-02Semiconductor device and temperature sensor structure for a semiconductor device
#41 | 2008-05-29Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
#42 | 2008-03-27Electronic device and method for production
#43 | 2008-01-17Semiconductor component and method for producing the same
#44 | 2008-01-10Integrated semiconductor chip with lateral thermal insulation
#45 | 2007-12-20Electrically conductive connection, electronic component and method for their production
#46 | 2007-11-22Metallization layer for a power semiconductor device
#47 | 2007-09-27Integrated circuit including a reverse current complex
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