Chee Ming Lam

City:

Melaka

Country:

Malaysia

Published Applications:

Last publication date:

2024-05-02

Top Assignees for applications by Chee Ming Lam

The entities that hold a legal rights for patent applications filed by inventor Lam Chee Ming:

Chee Ming Lam from Melaka, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

Power semiconductor device with dual heat dissipation structures

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE

Package lead design with grooves for improved dambar separation

InventorID:

4976771 ⎘