John DECKER

City:

Tempe, Arizona

Country:

United States

Published Applications:

Last publication date:

2021-09-02

Top Assignees for applications by John DECKER

The entities that hold a legal rights for patent applications filed by inventor DECKER John:

John DECKER from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package

Trenches in wafer level packages for improvements in warpage reliability and thermals

InventorID:

4995052 ⎘