Tempe, Arizona
United States
6
2025-10-23
The entities that hold a legal rights for patent applications filed by inventor DECKER John C.:
John C. DECKER from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE
#2 | 2024-09-26BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS
#3 | 2024-04-18MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE
#4 | 2024-01-18MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE
#5 | 2024-01-11MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE
#6 | 2021-03-04Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone
5019413 ⎘