Inventor profile of:

Andreas Lopp

City:

Freigericht

Country:

Germany

Published Applications:

21

Last publication date:

2026-05-28

Top Assignees for applications by Andreas Lopp

The entities that hold a legal rights for patent applications filed by inventor Lopp Andreas:

Recent patent applications by Lopp Andreas

Andreas Lopp from Freigericht, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-28
US20260146315A1
Chemistry; metallurgy

SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE

#2 | 2025-05-08
US20250146123A1
Chemistry; metallurgy

VAPOR SOURCE, NOZZLE, AND METHOD OF DEPOSITING AN EVAPORATED MATERIAL ON A SUBSTRATE

#3 | 2024-10-31
US20240360546A1
Chemistry; metallurgy

TEMPERATURE-CONTROLLED SHIELD, MATERIAL DEPOSITION APPARATUS AND METHOD FOR DEPOSITING A MATERIAL ONTO A SUBSTRATE

#4 | 2024-09-12
US20240301546A1
Chemistry; metallurgy

SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE

#5 | 2024-07-25
US20240247362A1
Chemistry; metallurgy

NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL

#6 | 2022-02-24
US20220056575A1
Chemistry; metallurgy

Material deposition apparatus having at least one heating assembly and method for pre- and/or post-heating a substrate

#7 | 2021-12-09
US20210381102A1
Chemistry; metallurgy

Temperature-controlled shield, material deposition apparatus and method for depositing a material onto a substrate

#8 | 2021-12-09
US20210381095A1
Chemistry; metallurgy

Vapor deposition apparatus and method for coating a substrate in a vacuum chamber

#9 | 2019-10-03
US20190301002A1
Chemistry; metallurgy

Mask arrangement for masking a substrate in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a mask arrangement for masking a substrate in a processing chamber

#10 | 2017-11-30
US20170342541A1
Chemistry; metallurgy

MASK ARRANGEMENT FOR MASKING A SUBSTRATE IN A PROCESSING CHAMBER

#11 | 2017-11-02
US20170314120A1
Chemistry; metallurgy

MATERIAL DEPOSITION ARRANGEMENT, A VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL

#12 | 2016-06-30
US20160189939A1
Electricity

MINI ROTATABLE SPUTTER DEVICES FOR SPUTTER DEPOSITION

#13 | 2015-01-01
US20150004312A1
Chemistry; metallurgy

ADJUSTABLE MASK

#14 | 2013-10-31
US20130284590A1
Chemistry; metallurgy

SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL

#15 | 2012-05-03
US20120107504A1
Chemistry; metallurgy

EVAPORATION SYSTEM AND METHOD

#16 | 2012-01-19
US20120012458A1
Electricity

Magnet arrangement for a target backing tube, target backing tube including the same, cylindrical target assembly and sputtering system

#17 | 2011-05-05
US20110100799A1
Electricity

SPUTTER DEPOSITION SYSTEM AND METHOD

#18 | 2010-02-04
US20100025370A1
Electricity

REACTIVE GAS DISTRIBUTOR, REACTIVE GAS TREATMENT SYSTEM, AND REACTIVE GAS TREATMENT METHOD

#19 | 2008-09-18
US20080223294A1
Chemistry; metallurgy

Flooding Chamber For Coating Installations

#20 | 2006-11-16
US20060254905A1
Electricity

Method for operating a sputter cathode with a target

#21 | 2006-10-05
US20060219550A1
Electricity

Magnet arrangement for a planar magnetron

InventorID:

503443 ⎘