Warstein
Germany
7
2020-08-06
The entities that hold a legal rights for patent applications filed by inventor Herbrandt Alexander:
Alexander Herbrandt from Warstein, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Electronic module with an electrically conductive press-fit terminal having a press-fit section
#2 | 2018-11-22Method for electrically connecting an electronic module and electronic assembly
#3 | 2017-10-26Directly Cooled Substrates for Semiconductor Modules
#4 | 2015-03-26Substrate, chip arrangement, and method for manufacturing the same
#5 | 2014-11-06Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
#6 | 2014-10-30Directly cooled substrates for semiconductor modules and corresponding manufacturing methods
#7 | 2013-10-31Power module with directly attached thermally conductive structures
504264 ⎘