Kyeongbin Lim

City:

Seoul

Country:

South Korea

Published Applications:

Last publication date:

2023-06-08

Top Assignees for applications by Kyeongbin Lim

The entities that hold a legal rights for patent applications filed by inventor Lim Kyeongbin:

Kyeongbin Lim from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

DIE ALIGNMENT METHOD USING MAGNETIC FORCE

SUBSTRATE TRANSFER APPARATUS

Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus

WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AND WAFER TO WAFER BONDING METHOD

Substrate bonding apparatus

InventorID:

5048847 ⎘