Mark ALLEN

City:

Gilbert, Arizona

Country:

United States

Published Applications:

Last publication date:

2021-04-08

Top Assignees for applications by Mark ALLEN

The entities that hold a legal rights for patent applications filed by inventor ALLEN Mark:

Mark ALLEN from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level

InventorID:

5048900 ⎘