Campbell, California
United States
11
2024-07-18
The entities that hold a legal rights for patent applications filed by inventor XIA Yi:
Yi XIA from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OUTSIDE A CHIP PACKAGE
#2 | 2023-12-28COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
#3 | 2023-12-28TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
#4 | 2023-01-26METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE COOLING DEVICE
#5 | 2022-07-14THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
#6 | 2022-06-23LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
#7 | 2022-04-14ENHANCED ELECTRONIC PACKAGE THERMAL DISSIPATION WITH IN-SITU TRANSPIRATION COOLING AND REDUCED THERMAL INTERSTITIAL RESISTANCE
#8 | 2022-03-10TUNABLE STACK-UP DIMM FORM FACTOR COLD PLATE WITH EMBEDDED PELTIER DEVICES FOR ENHANCED COOLING CAPABILITY
#9 | 2021-09-16Thermal control for processor-based devices
#10 | 2021-04-22Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips
#11 | 2021-04-22Optical leak detection of liquid cooling components within an electronic system
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