Gyeonggi-do
South Korea
20
2024-01-04
The entities that hold a legal rights for patent applications filed by inventor JOENG Eun Sun:
Eun Sun JOENG from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
BIODEGRADABLE POLYESTER RESIN COMPOSITION, METHOD OF PREPARING THE SAME AND BIODEGRADABLE MOLDED ARTICLE INCLUDING BIODEGRADABLE POLYESTER RESIN COMPOSITION
#2 | 2023-12-14BIODEGRADABLE POLYESTER RESIN COMPOSITION, BIODEGRADABLE POLYESTER FILM INCLUDING THE SAME AND BIODEGRADABLE MOLDED ARTICLE INCLUDING BIODEGRADABLE POLYESTER RESIN COMPOSITION
#3 | 2023-11-23BIODEGRADABLE MOLDED ARTICLE AND BIODEGRADABLE POLYESTER RESIN COMPOSITION AND BIODEGRADABLE POLYESTER FILM
#4 | 2023-11-23BIODEGRADABLE POLYESTER RESIN COMPOSITION AND BIODEGRADABLE MOLDED ARTICLE INCLUDING BIODEGRADABLE POLYESTER RESIN COMPOSITION
#5 | 2023-11-23Biodegradable polyester resin composition, biodegradable polyester film including the same and biodegradable molded article including biodegradable polyester resin composition
#6 | 2023-07-20COMPOSITION FOR SEMICONDUCTOR PROCESS, METHOD FOR PREPARING THE SAME AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING THE SAME
#7 | 2023-04-13POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#8 | 2023-04-13POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#9 | 2023-02-16POLISHING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#10 | 2023-02-09POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#11 | 2022-12-29POLISHING PAD AND METHOD FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME
#12 | 2022-11-24POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#13 | 2022-11-10POLISHING PAD, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#14 | 2022-09-15POLISHING PAD, METHOD FOR PRODUCING THE SAME AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
#15 | 2022-06-30POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#16 | 2022-03-31Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same
#17 | 2022-03-31POLISHING PAD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
#18 | 2022-03-10Polishing pad and method of fabricating semiconductor device using the same
#19 | 2022-03-10Polishing pad and method of fabricating semiconductor device using the same
#20 | 2021-04-29Composition for polishing pad and polishing pad
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