Inventor profile of:

Eunseok CHO

City:

Suwon-si

Country:

South Korea

Published Applications:

18

Last publication date:

2026-04-09

Top Assignees for applications by Eunseok CHO

The entities that hold a legal rights for patent applications filed by inventor CHO Eunseok:

Recent patent applications by CHO Eunseok

Eunseok CHO from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-09
US20260101822A1
Electricity

SEMICONDUCTOR PACKAGE

#2 | 2025-07-03
US20250218969A1
Electricity

SEMICONDUCTOR PACKAGE

#3 | 2025-06-05
US20250183214A1
Electricity

SEMICONDUCTOR PACKAGE

#4 | 2025-04-17
US20250125236A1
Electricity

SEMICONDUCTOR PACKAGE

#5 | 2017-08-10
US20170229373A1
Electricity

Thermoelectric cooling packages and thermal management methods thereof

#6 | 2017-06-29
US20170185119A1
Physics

Surface temperature management method of mobile device and memory thermal management method of multichip package

#7 | 2016-03-24
US20160084542A1
Mechanical engineering

Thermoelectric cooling packages and thermal management methods thereof

#8 | 2015-03-26
US20150084170A1
Electricity

Semiconductor package and method of fabricating the same

#9 | 2014-11-06
US20140327129A1
Electricity

PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

#10 | 2014-07-03
US20140184312A1
Physics

SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF

#11 | 2014-05-15
US20140136827A1
Physics

MOBILE DEVICE AND DATA COMMUNICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT OF MOBILE DEVICE

#12 | 2013-12-05
US20130321041A1
Electricity

Electronic device and method for controlling temperature thereof

#13 | 2013-06-27
US20130166093A1
Electricity

ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF

#14 | 2013-06-06
US20130139524A1
Mechanical engineering

Thermoelectric cooling packages and thermal management methods thereof

#15 | 2013-04-11
US20130091348A1
Physics

Surface temperature management method of mobile device and memory thermal management method of multichip package

#16 | 2013-03-07
US20130057559A1
Physics

Display devices

#17 | 2013-01-24
US20130021768A1
Electricity

Chip-on-film packages and device assemblies including the same

#18 | 2011-01-27
US20110018119A1
Electricity

Semiconductor packages including heat slugs

InventorID:

50630 ⎘