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Inventor profile of:

Prithwish CHATTERJEE

City:

Chandler, Arizona

Country:

United States

Published Applications:

6

Last publication date:

2025-07-03

Top Assignees for applications by Prithwish CHATTERJEE

The entities that hold a legal rights for patent applications filed by inventor CHATTERJEE Prithwish:

  • INTEL CORPORATION 5 Santa Clara, CA United States

Recent patent applications by CHATTERJEE Prithwish

Prithwish CHATTERJEE from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-03
US20250219002A1
Electricity

ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS

#2 | 2025-07-03
US20250218925A1
Electricity

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WITH THIN NICKEL LAYER AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS

#3 | 2025-07-03
US20250218924A1
Electricity

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS

#4 | 2025-07-03
US20250218911A1
Electricity

ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS

#5 | 2025-07-03
US20250218910A1
Electricity

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS

#6 | 2021-05-06
US20210134727A1
Electricity

Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch

InventorID:

5073269 ⎘

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