Daniel Volkmann

City:

Bensheim

Country:

Germany

Published Applications:

Last publication date:

2024-10-24

Top Assignees for applications by Daniel Volkmann

The entities that hold a legal rights for patent applications filed by inventor Volkmann Daniel:

Daniel Volkmann from Bensheim, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Modular Connector Assembly

Crimp contact, crimp connection and method for making a crimp connection

Chiclets for a chiclet connector

HF terminal for an HF connector, and a method for improving the quality of a signal integrity of a male HF connector or of an HF plug-in connector

InventorID:

5086750 ⎘