Thalmassing
Germany
4
2023-11-16
The entities that hold a legal rights for patent applications filed by inventor Boehm Marcus:
Marcus Boehm from Thalmassing, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Molded semiconductor package having an embedded inlay
#2 | 2023-05-25MINIMIZATION OF STOKES' LOSSES DUE TO PHOTON MULTIPLICATION PROCESSES FOR IR APPLICATIONS
#3 | 2021-08-26µLED Chip Architecture Based on Nanostructured Perovskite Converter Materials
#4 | 2021-07-22Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method
5144088 ⎘