Wuhan
China
84
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor WANG Di:
Di WANG from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#2 | 2026-05-28MEMORY DEVICE AND METHOD OF FORMING THE SAME
#3 | 2026-05-28MANAGING CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES
#4 | 2026-05-21THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#5 | 2026-03-05VERTICAL MEMORY DEVICES AND METHOD OF FABRICATION THEREOF
#6 | 2026-02-12THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#7 | 2025-12-18THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#8 | 2025-11-27MANAGING TOP SELECT GATES IN SEMICONDUCTOR DEVICES
#9 | 2025-11-27MANAGING CONNECTION STRUCTURES IN SEMICONDUCTOR DEVICES
#10 | 2025-11-20DYNAMIC FLASH MEMORY (DFM) WITH RING-TYPE INSULATOR IN CHANNEL FOR IMPROVED RETENTION
#11 | 2025-11-20SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND MEMORY SYSTEM
#12 | 2025-10-23CONTACT STRUCTURES IN THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES
#13 | 2025-10-16SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#14 | 2025-10-16ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES
#15 | 2025-10-02SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF
#16 | 2025-10-02SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF
#17 | 2025-07-31CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#18 | 2025-07-24THREE-DIMENSIONAL MEMORY DEVICE WITH DIVIDED DRAIN SELECT GATE LINES AND METHOD FOR FORMING THE SAME
#19 | 2025-06-19THREE-DIMENSIONAL NAND MEMORY AND FABRICATION METHOD THEREOF
#20 | 2025-04-29Marine fuel cell-based integrated heat, electricity, and cooling supply system
#21 | 2025-03-13THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
#22 | 2025-02-13SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, THREE-DIMENSIONAL MEMORY
#23 | 2025-02-13DRAM MEMORY DEVICE WITH XTACKING ARCHITECTURE
#24 | 2025-02-06SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM
#25 | 2025-01-30SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF AND MEMORY SYSTEM
#26 | 2025-01-30THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#27 | 2025-01-09SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF
#28 | 2024-12-26THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYSTEM, AND ELECTRONIC APPARATUS
#29 | 2024-12-26THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND ELECTRONIC APPARATUS
#30 | 2024-12-12BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND MEMORY AND FABRICATION METHODS THEREOF
#31 | 2024-11-21FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MEMORY SYSTEM
#32 | 2024-09-26METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES
#33 | 2024-09-05MEMORY DEVICE WITH WORD LINES AND CONTACT LANDING
#34 | 2024-08-22VERTICAL MEMORY DEVICES AND METHODS FOR OPERATING THE SAME
#35 | 2024-08-15STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
#36 | 2024-07-04THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#37 | 2024-06-27THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#38 | 2024-06-27THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#39 | 2024-06-27THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#40 | 2024-06-27MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#41 | 2024-06-27MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#42 | 2024-06-27THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#43 | 2024-06-20MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#44 | 2024-06-20MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#45 | 2024-06-06THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#46 | 2024-06-06MEMORY DEVICE AND METHOD OF FORMING THE SAME
#47 | 2024-05-23THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#48 | 2024-03-28THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#49 | 2024-03-28THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#50 | 2024-03-28THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#51 | 2023-12-28VERTICAL MEMORY DEVICES AND METHOD OF FABRICATION THEREOF
#52 | 2023-12-21THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
#53 | 2023-12-21THREE-DIMENSIONAL MEMORY DEVICE HAVING STAIRCASE STRUCTURE AND METHOD FOR FORMING THE SAME
#54 | 2023-12-21THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#55 | 2023-11-09THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#56 | 2023-11-09Three-dimensional memory devices and fabricating methods thereof
#57 | 2023-11-09THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#58 | 2023-11-02Dynamic flash memory (DFM) with multi-cells
#59 | 2023-11-02DYNAMIC FLASH MEMORY (DFM) WITH RING-TYPE INSULATOR IN CHANNEL FOR IMPROVED RETENTION
#60 | 2023-11-02DYNAMIC FLASH MEMORY (DFM) WITH CHANNEL FIRST SCHEME
#61 | 2023-11-02DYNAMIC FLASH MEMORY (DFM) WITH TRI-GATE FOR HIGH EFFICIENCY OPERATION
#62 | 2023-10-12DRAM memory device with Xtacking architecture
#63 | 2023-09-07THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
#64 | 2023-08-10Staircase structure in three-dimensional memory device and method for forming the same
#65 | 2023-06-22Barrier layers for word line contacts in a three-dimensional NAND memory and fabrication methods thereof
#66 | 2023-06-15Three-dimensional memory device with divided drain select gate lines and method for forming the same
#67 | 2023-06-15VERTICAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#68 | 2023-05-11Vertical memory devices and methods for operating the same
#69 | 2023-05-04Three-dimensional memory device having staircase structure and method for forming the same
#70 | 2023-03-16Three-dimensional memory devices and methods for forming the same
#71 | 2023-02-23THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#72 | 2023-02-23THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
#73 | 2022-12-15Three-dimensional memory devices and methods for forming the same
#74 | 2022-12-01Three-dimensional memory device and method for forming the same
#75 | 2022-11-17Three-dimensional NAND memory and fabrication method thereof
#76 | 2022-08-25Contact structures for three-dimensional memory devices and methods for forming the same
#77 | 2022-03-17Staircase structure in three-dimensional memory device and method for forming the same
#78 | 2022-01-20Methods for bonding semiconductor structures and semiconductor devices thereof
#79 | 2021-12-09CONTACT PAD STRUCTURE AND METHOD OF FORMING THE SAME
#80 | 2021-12-09Staircase structure in three-dimensional memory device and method for forming the same
#81 | 2021-12-09Staircase structure in three-dimensional memory device and method for forming the same
#82 | 2021-10-14Three-dimensional memory device including a peripheral circuit and a memory stack
#83 | 2021-08-26DRAM memory device with xtacking architecture
#84 | 2021-08-19Three dimensional NAND memory device with novel support structures
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