Chia Hsing Wei

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-05-01

Top Assignees for applications by Chia Hsing Wei

The entities that hold a legal rights for patent applications filed by inventor Wei Chia Hsing:

Chia Hsing Wei from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS

Lockout tagout assembly and system and method of using same

InventorID:

5192062 ⎘