Bohan SHAN

City:

Tempe, Arizona

Country:

United States

Published Applications:

Last publication date:

2026-03-19

Top Assignees for applications by Bohan SHAN

The entities that hold a legal rights for patent applications filed by inventor SHAN Bohan:

Bohan SHAN from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

PLASMA-BASED GLASS PACKAGE DICING

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS

NO-REMELT SOLDER ENFORCEMENT JOINT

OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX

Microelectronic structures including bridges

COMPOSITE DRY FILM RESIST FOR PHOTOLITHOGRAPHY

InventorID:

5215525 ⎘