Inventor profile of:

Thomas Plach

City:

Linz

Country:

Austria

Published Applications:

16

Last publication date:

2023-09-21

Top Assignees for applications by Thomas Plach

The entities that hold a legal rights for patent applications filed by inventor Plach Thomas:

Recent patent applications by Plach Thomas

Thomas Plach from Linz, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-09-21
US20230294390A1
Performing operations; transporting

DEVICE AND METHOD FOR BONDING SUBSTRATES

#2 | 2021-09-23
US20210291504A1
Performing operations; transporting

Device and method for bonding substrates

#3 | 2019-07-18
US20190217595A1
Performing operations; transporting

Device and method for bonding substrates

#4 | 2019-07-18
US20190217594A1
Performing operations; transporting

Device and method for bonding substrates

#5 | 2019-07-11
US20190210350A1
Performing operations; transporting

Device and method for bonding substrates

#6 | 2019-07-11
US20190210349A1
Performing operations; transporting

Device and method for bonding substrates

#7 | 2019-07-11
US20190210348A1
Performing operations; transporting

Device and method for bonding substrates

#8 | 2019-01-03
US20190006313A1
Electricity

METHOD FOR PERMANENT BONDING OF WAFERS

#9 | 2017-08-10
US20170229423A1
Electricity

METHOD FOR PERMANENTLY BONDING WAFERS

#10 | 2016-04-21
US20160111394A1
Electricity

Method for permanent bonding of wafers

#11 | 2015-07-30
US20150210057A1
Performing operations; transporting

Device and method for bonding substrates

#12 | 2015-06-18
US20150165752A1
Performing operations; transporting

METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS

#13 | 2014-03-13
US20140073112A1
Electricity

Method for permanently bonding wafers

#14 | 2014-02-20
US20140051231A1
Electricity

Method for permanently bonding wafers

#15 | 2014-01-16
US20140017877A1
Electricity

Method for permanently bonding wafers

#16 | 2013-11-14
US20130299080A1
Electricity

Method for permanent bonding of wafers

InventorID:

524205 ⎘