St. Florian am Inn
Austria
213
2026-06-25
171
2025-10-28
These are the the leading inventors for applications assigned to EV GROUP E. THALLNER GMBH:
EV GROUP E. THALLNER GMBH based in St. Florian am Inn, AT has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
METHOD AND DEVICE FOR DETACHING A STAMP
#2 | 2026-06-18SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE
#3 | 2026-02-05DEVICE AND METHOD FOR MEASURING A SUBSTRATE
#4 | 2026-01-22METHOD AND DEVICE FOR BONDING OF CHIPS
#5 | 2025-12-04APPARATUS AND METHOD FOR BONDING SUBSTRATES
#6 | 2025-11-20MULTI-LAYER SYSTEM COMPRISING THIN LAYERS FOR TEMPORARY BONDING
#7 | 2025-07-17METHOD AND DEVICE FOR PRODUCING MICRO- AND/OR NANOSTRUCTURES
#8 | 2025-05-15METHOD AND SUBSTRATE SYSTEM FOR THE SEPARATION OF CARRIER SUBSTRATES
#9 | 2025-04-17METHOD AND DEVICE FOR COMPENSATING FOR DISTORTIONS
#10 | 2025-02-06METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE
#11 | 2024-12-19METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#12 | 2024-12-19DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS
#13 | 2024-12-19METHOD AND DEVICE FOR TRANSFERRING COMPONENTS
#14 | 2024-11-28METHOD AND DEVICE FOR TRANSFERRING AND PREPARING COMPONENTS
#15 | 2024-11-21METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
#16 | 2024-11-21DEVICE AND METHOD FOR BONDING
#17 | 2024-10-24METHOD FOR PREFIXING OF SUBSTRATES
#18 | 2024-06-27DEVICE AND METHOD FOR BONDING OF SUBSTRATES
#19 | 2024-05-23 β Patent 12,456,720 granted on 2025-10-28METHOD AND DEVICE FOR BONDING OF CHIPS
#20 | 2024-02-15DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES
#21 | 2024-02-08 β Patent 12,087,726 granted on 2024-09-10Device and method for joining substrates
#22 | 2023-12-07 β Patent 12,622,221 granted on 2026-05-05METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE
#23 | 2023-11-16 β Patent 12,635,477 granted on 2026-05-19SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR BONDING
#24 | 2023-11-02CARRIER SUBSTRATE, METHOD FOR PRODUCING A CARRIER SUBSTRATE, AND METHOD FOR TRANSFERRING A TRANSFER LAYER FROM A CARRIER SUBSTRATE TO A PRODUCT SUBSTRATE
#25 | 2023-09-21DEVICE AND METHOD FOR BONDING SUBSTRATES
#26 | 2023-09-14 β Patent 12,577,678 granted on 2026-03-17METHOD FOR APPLYING A PROTECTIVE COATING MATERIAL
#27 | 2023-08-10 β Patent 12,481,222 granted on 2025-11-25METHOD AND DEVICE FOR THE EXPOSURE OF A PHOTOSENSITIVE COATING
#28 | 2023-07-20 β Patent 12,550,679 granted on 2026-02-10SUBSTRATE HOLDER DEVICE AND METHOD FOR BONDING
#29 | 2023-07-20 β Patent 12,292,682 granted on 2025-05-06Method and device for producing micro- and/or nanostructures
#30 | 2023-07-06 β Patent 11,865,824 granted on 2024-01-09Method and device for transferring a transfer layer
#31 | 2023-06-29 β Patent 12,199,062 granted on 2025-01-14Device and method for the alignment of substrates
#32 | 2023-06-29METHOD AND DEVICE FOR BONDING SUBSTRATES
#33 | 2023-06-15 β Patent 12,581,908 granted on 2026-03-17SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE
#34 | 2023-05-18DEVICE AND METHOD FOR INJECTION MOLDING
#35 | 2023-04-20 β Patent 11,862,487 granted on 2024-01-02Device and method for bonding of two substrates
#36 | 2023-03-02 β Patent 12,103,787 granted on 2024-10-01Method and device for transferring components
#37 | 2023-01-19 β Patent 12,106,993 granted on 2024-10-01Method and device for aligning substrates
#38 | 2023-01-19 β Patent 12,283,491 granted on 2025-04-22Method for producing singulated encapsulated components
#39 | 2023-01-05DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES
#40 | 2022-12-29 β Patent 12,482,678 granted on 2025-11-25APPARATUS AND METHOD FOR HEATING A SUBSTRATE
#41 | 2022-12-08 β Patent 12,467,850 granted on 2025-11-11DEVICE AND METHOD FOR MEASURING A SUBSTRATE
#42 | 2022-10-27 β Patent 12,600,062 granted on 2026-04-14METHOD AND DEVICE FOR DETACHING A STAMP
#43 | 2022-09-22METHOD AND DEVICE FOR THE ALIGNMENT OF SUBSTRATES
#44 | 2022-08-25 β Patent 12,027,383 granted on 2024-07-02Device for alignment of two substrates
#45 | 2022-08-18 β Patent 11,756,818 granted on 2023-09-12Accommodating device for retaining wafers
#46 | 2022-07-21 β Patent 12,062,521 granted on 2024-08-13Method for prefixing of substrates
#47 | 2022-07-07 β Patent 11,776,842 granted on 2023-10-03Method and device for surface treatment of substrates
#48 | 2022-06-02 β Patent 12,412,865 granted on 2025-09-09APPARATUS AND METHOD FOR BONDING SUBSTRATES
#49 | 2022-05-26 β Patent 12,107,057 granted on 2024-10-01Method for permanent connection of two metal surfaces
#50 | 2022-05-05 β Patent 11,562,912 granted on 2023-01-24Device and method for bonding of two substrates
#51 | 2022-04-28 β Patent 11,527,410 granted on 2022-12-13Device and method for bonding of substrates
#52 | 2022-03-31 β Patent 11,955,339 granted on 2024-04-09Device and method for bonding of substrates
#53 | 2022-01-27 β Patent 12,025,426 granted on 2024-07-02Measuring device and method for determining the course of a bonding wave
#54 | 2021-11-04 β Patent 11,742,205 granted on 2023-08-29Method and device for bonding of substrates
#55 | 2021-09-23 β Patent 11,697,281 granted on 2023-07-11Device and method for bonding substrates
#56 | 2021-08-12 β Patent 11,681,228 granted on 2023-06-20Method and apparatus for illuminating image points
#57 | 2021-08-05 β Patent 12,135,500 granted on 2024-11-05Stamp and method for embossing
#58 | 2021-07-01 β Patent 11,862,466 granted on 2024-01-02Method and device for bonding substrates
#59 | 2021-06-17METHOD AND DEVICE FOR BONDING SUBSTRATES
#60 | 2021-06-17 β Patent 11,276,589 granted on 2022-03-15Device and method for bonding of two substrates
#61 | 2021-05-20 β Patent 11,488,851 granted on 2022-11-01Method and device for alignment of substrates
#62 | 2021-05-06 β Patent 11,990,463 granted on 2024-05-21Device for bonding chips
#63 | 2021-05-06METHOD AND DEVICE FOR EMBOSSING OF A NANOSTRUCTURE
#64 | 2021-04-29 β Patent 11,901,172 granted on 2024-02-13Method and device for the surface treatment of substrates
#65 | 2021-04-08 β Patent 11,355,374 granted on 2022-06-07Accommodating device for retaining wafers
#66 | 2021-03-11 β Patent 11,251,045 granted on 2022-02-15Device and method for bonding of substrates
#67 | 2021-03-04 β Patent 11,534,868 granted on 2022-12-27Device and method for separating a temporarily bonded substrate stack
#68 | 2020-12-24 β Patent 11,348,825 granted on 2022-05-31Method and device for surface treatment of substrates
#69 | 2020-10-22 β Patent 10,861,699 granted on 2020-12-08Device and method for bonding of substrates
#70 | 2020-10-22 β Patent 11,680,792 granted on 2023-06-20Incoming runout measurement method
#71 | 2020-09-10 β Patent 11,101,132 granted on 2021-08-24Method and device for bonding of substrates
#72 | 2020-07-16 β Patent 10,943,807 granted on 2021-03-09Method and device for alignment of substrates
#73 | 2020-07-09 β Patent 10,748,770 granted on 2020-08-18Device and method for bonding of substrates
#74 | 2020-06-25 β Patent 10,755,930 granted on 2020-08-25Method and device for bonding of substrates
#75 | 2020-06-04 β Patent 11,764,198 granted on 2023-09-19Method and device for bonding of chips
#76 | 2020-06-04 β Patent 11,209,739 granted on 2021-12-28Method and apparatus for aligning two optical subsystems
#77 | 2020-05-28 β Patent 11,315,901 granted on 2022-04-26Method for bonding substrates
#78 | 2020-03-19 β Patent 11,460,777 granted on 2022-10-04Method and device for exposure of photosensitive layer
#79 | 2020-03-05 β Patent 11,040,525 granted on 2021-06-22Method for embossing micro-structures and/or nano-structures
#80 | 2020-02-27 β Patent 10,636,662 granted on 2020-04-28Device and method for bonding of substrates
#81 | 2020-02-20 β Patent 10,954,122 granted on 2021-03-23Method for bonding of at least three substrates
#82 | 2020-02-13 β Patent 10,906,293 granted on 2021-02-02Method and device for embossing of a nanostructure
#83 | 2020-01-23 β Patent 10,991,609 granted on 2021-04-27Method and substrate holder for the controlled bonding of substrates
#84 | 2020-01-16 β Patent 10,796,944 granted on 2020-10-06Method and device for surface treatment of substrates
#85 | 2020-01-09 β Patent 11,024,530 granted on 2021-06-01Method for the bonding and debonding of substrates
#86 | 2019-12-26 β Patent 10,971,365 granted on 2021-04-06Method and device for bonding substrates
#87 | 2019-12-19 β Patent 11,328,939 granted on 2022-05-10Method for prefixing of substrates
#88 | 2019-12-12 β Patent 11,121,091 granted on 2021-09-14Method for arranging two substrates
#89 | 2019-12-05 β Patent 11,139,170 granted on 2021-10-05Apparatus and method for bonding substrates
#90 | 2019-11-21 β Patent 11,270,902 granted on 2022-03-08Electrostatic substrate holder
#91 | 2019-11-21 β Patent 10,994,470 granted on 2021-05-04Structure stamp, device and method for embossing
#92 | 2019-10-24 β Patent 11,361,980 granted on 2022-06-14Device for alignment of two substrates
#93 | 2019-09-26 β Patent 10,852,528 granted on 2020-12-01Method and device for exposure of photosensitive layer
#94 | 2019-08-08 β Patent 11,282,706 granted on 2022-03-22Device and method for bonding of substrates
#95 | 2019-07-25 β Patent 10,964,562 granted on 2021-03-30Device and method for bonding of two substrates
#96 | 2019-07-18 β Patent 11,020,953 granted on 2021-06-01Device and method for bonding substrates
#97 | 2019-07-18 β Patent 11,020,952 granted on 2021-06-01Device and method for bonding substrates
#98 | 2019-07-11 β Patent 11,020,951 granted on 2021-06-01Device and method for bonding substrates
#99 | 2019-07-11 β Patent 11,020,950 granted on 2021-06-01Device and method for bonding substrates
#100 | 2019-07-11 β Patent 11,059,280 granted on 2021-07-13Device and method for bonding substrates
Also check out EV Group E. Thallner GmbH's (St. Florian am Inn, Austria) applicant profile with 163 patent applications submitted.
3552 β