Assignee profile:

EV GROUP E. THALLNER GMBH

City:

St. Florian am Inn

Country:

Austria

Published Applications:

213

Last publication date:

2026-06-25

Patent Grants:

171

Last grant date:

2025-10-28

Quarterly EV GROUP E. THALLNER GMBH Patent Applications

Top Inventors for applications by EV GROUP E. THALLNER GMBH

These are the the leading inventors for applications assigned to EV GROUP E. THALLNER GMBH:

Recent patent applications by EV GROUP E. THALLNER GMBH

EV GROUP E. THALLNER GMBH based in St. Florian am Inn, AT has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-06-25
US20260175473A1
Performing operations; transporting

METHOD AND DEVICE FOR DETACHING A STAMP

#2 | 2026-06-18
US20260173814A1
Electricity

SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE

#3 | 2026-02-05
US20260036511A1
Physics

DEVICE AND METHOD FOR MEASURING A SUBSTRATE

#4 | 2026-01-22
US20260026410A1
Electricity

METHOD AND DEVICE FOR BONDING OF CHIPS

#5 | 2025-12-04
US20250372571A1
Electricity

APPARATUS AND METHOD FOR BONDING SUBSTRATES

#6 | 2025-11-20
US20250357175A1
Electricity

MULTI-LAYER SYSTEM COMPRISING THIN LAYERS FOR TEMPORARY BONDING

#7 | 2025-07-17
US20250231478A1
Physics

METHOD AND DEVICE FOR PRODUCING MICRO- AND/OR NANOSTRUCTURES

#8 | 2025-05-15
US20250153481A1
Performing operations; transporting

METHOD AND SUBSTRATE SYSTEM FOR THE SEPARATION OF CARRIER SUBSTRATES

#9 | 2025-04-17
US20250125152A1
Electricity

METHOD AND DEVICE FOR COMPENSATING FOR DISTORTIONS

#10 | 2025-02-06
US20250046639A1
Electricity

METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE

#11 | 2024-12-19
US20240421109A1
Electricity

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

#12 | 2024-12-19
US20240420976A1
Electricity

DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS

#13 | 2024-12-19
US20240417189A1
Performing operations; transporting

METHOD AND DEVICE FOR TRANSFERRING COMPONENTS

#14 | 2024-11-28
US20240395576A1
Electricity

METHOD AND DEVICE FOR TRANSFERRING AND PREPARING COMPONENTS

#15 | 2024-11-21
US20240387270A1
Electricity

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

#16 | 2024-11-21
US20240387202A1
Electricity

DEVICE AND METHOD FOR BONDING

#17 | 2024-10-24
US20240355582A1
Electricity

METHOD FOR PREFIXING OF SUBSTRATES

#18 | 2024-06-27
US20240213025A1
Electricity

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

#19 | 2024-05-23 βœ… Patent 12,456,720 granted on 2025-10-28
US20240170474A1
Electricity

METHOD AND DEVICE FOR BONDING OF CHIPS

#20 | 2024-02-15
US20240053682A1
Physics

DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES

#21 | 2024-02-08 βœ… Patent 12,087,726 granted on 2024-09-10
US20240047414A1
Electricity

Device and method for joining substrates

#22 | 2023-12-07 βœ… Patent 12,622,221 granted on 2026-05-05
US20230395418A1
Electricity

METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE

#23 | 2023-11-16 βœ… Patent 12,635,477 granted on 2026-05-19
US20230369095A1
Electricity

SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR BONDING

#24 | 2023-11-02
US20230347637A1
Performing operations; transporting

CARRIER SUBSTRATE, METHOD FOR PRODUCING A CARRIER SUBSTRATE, AND METHOD FOR TRANSFERRING A TRANSFER LAYER FROM A CARRIER SUBSTRATE TO A PRODUCT SUBSTRATE

#25 | 2023-09-21
US20230294390A1
Performing operations; transporting

DEVICE AND METHOD FOR BONDING SUBSTRATES

#26 | 2023-09-14 βœ… Patent 12,577,678 granted on 2026-03-17
US20230287571A1
Chemistry; metallurgy

METHOD FOR APPLYING A PROTECTIVE COATING MATERIAL

#27 | 2023-08-10 βœ… Patent 12,481,222 granted on 2025-11-25
US20230251580A1
Physics

METHOD AND DEVICE FOR THE EXPOSURE OF A PHOTOSENSITIVE COATING

#28 | 2023-07-20 βœ… Patent 12,550,679 granted on 2026-02-10
US20230230871A1
Electricity

SUBSTRATE HOLDER DEVICE AND METHOD FOR BONDING

#29 | 2023-07-20 βœ… Patent 12,292,682 granted on 2025-05-06
US20230229076A1
Physics

Method and device for producing micro- and/or nanostructures

#30 | 2023-07-06 βœ… Patent 11,865,824 granted on 2024-01-09
US20230211592A1
Performing operations; transporting

Method and device for transferring a transfer layer

#31 | 2023-06-29 βœ… Patent 12,199,062 granted on 2025-01-14
US20230207513A1
Electricity

Device and method for the alignment of substrates

#32 | 2023-06-29
US20230207379A1
Electricity

METHOD AND DEVICE FOR BONDING SUBSTRATES

#33 | 2023-06-15 βœ… Patent 12,581,908 granted on 2026-03-17
US20230187259A1
Electricity

SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE

#34 | 2023-05-18
US20230150180A1
Performing operations; transporting

DEVICE AND METHOD FOR INJECTION MOLDING

#35 | 2023-04-20 βœ… Patent 11,862,487 granted on 2024-01-02
US20230117625A1
Electricity

Device and method for bonding of two substrates

#36 | 2023-03-02 βœ… Patent 12,103,787 granted on 2024-10-01
US20230062106A1
Performing operations; transporting

Method and device for transferring components

#37 | 2023-01-19 βœ… Patent 12,106,993 granted on 2024-10-01
US20230018538A1
Electricity

Method and device for aligning substrates

#38 | 2023-01-19 βœ… Patent 12,283,491 granted on 2025-04-22
US20230015545A1
Electricity

Method for producing singulated encapsulated components

#39 | 2023-01-05
US20230001723A1
Performing operations; transporting

DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES

#40 | 2022-12-29 βœ… Patent 12,482,678 granted on 2025-11-25
US20220415675A1
Electricity

APPARATUS AND METHOD FOR HEATING A SUBSTRATE

#41 | 2022-12-08 βœ… Patent 12,467,850 granted on 2025-11-11
US20220390356A1
Physics

DEVICE AND METHOD FOR MEASURING A SUBSTRATE

#42 | 2022-10-27 βœ… Patent 12,600,062 granted on 2026-04-14
US20220339825A1
Performing operations; transporting

METHOD AND DEVICE FOR DETACHING A STAMP

#43 | 2022-09-22
US20220301907A1
Electricity

METHOD AND DEVICE FOR THE ALIGNMENT OF SUBSTRATES

#44 | 2022-08-25 βœ… Patent 12,027,383 granted on 2024-07-02
US20220270896A1
Electricity

Device for alignment of two substrates

#45 | 2022-08-18 βœ… Patent 11,756,818 granted on 2023-09-12
US20220262663A1
Electricity

Accommodating device for retaining wafers

#46 | 2022-07-21 βœ… Patent 12,062,521 granted on 2024-08-13
US20220230849A1
Electricity

Method for prefixing of substrates

#47 | 2022-07-07 βœ… Patent 11,776,842 granted on 2023-10-03
US20220216098A1
Electricity

Method and device for surface treatment of substrates

#48 | 2022-06-02 βœ… Patent 12,412,865 granted on 2025-09-09
US20220173068A1
Electricity

APPARATUS AND METHOD FOR BONDING SUBSTRATES

#49 | 2022-05-26 βœ… Patent 12,107,057 granted on 2024-10-01
US20220165690A1
Electricity

Method for permanent connection of two metal surfaces

#50 | 2022-05-05 βœ… Patent 11,562,912 granted on 2023-01-24
US20220139735A1
Electricity

Device and method for bonding of two substrates

#51 | 2022-04-28 βœ… Patent 11,527,410 granted on 2022-12-13
US20220130674A1
Electricity

Device and method for bonding of substrates

#52 | 2022-03-31 βœ… Patent 11,955,339 granted on 2024-04-09
US20220102146A1
Electricity

Device and method for bonding of substrates

#53 | 2022-01-27 βœ… Patent 12,025,426 granted on 2024-07-02
US20220026196A1
Physics

Measuring device and method for determining the course of a bonding wave

#54 | 2021-11-04 βœ… Patent 11,742,205 granted on 2023-08-29
US20210343530A1
Electricity

Method and device for bonding of substrates

#55 | 2021-09-23 βœ… Patent 11,697,281 granted on 2023-07-11
US20210291504A1
Performing operations; transporting

Device and method for bonding substrates

#56 | 2021-08-12 βœ… Patent 11,681,228 granted on 2023-06-20
US20210247697A1
Physics

Method and apparatus for illuminating image points

#57 | 2021-08-05 βœ… Patent 12,135,500 granted on 2024-11-05
US20210240075A1
Physics

Stamp and method for embossing

#58 | 2021-07-01 βœ… Patent 11,862,466 granted on 2024-01-02
US20210202251A1
Electricity

Method and device for bonding substrates

#59 | 2021-06-17
US20210183666A1
Electricity

METHOD AND DEVICE FOR BONDING SUBSTRATES

#60 | 2021-06-17 βœ… Patent 11,276,589 granted on 2022-03-15
US20210183665A1
Electricity

Device and method for bonding of two substrates

#61 | 2021-05-20 βœ… Patent 11,488,851 granted on 2022-11-01
US20210151339A1
Electricity

Method and device for alignment of substrates

#62 | 2021-05-06 βœ… Patent 11,990,463 granted on 2024-05-21
US20210134782A1
Electricity

Device for bonding chips

#63 | 2021-05-06
US20210129520A1
Performing operations; transporting

METHOD AND DEVICE FOR EMBOSSING OF A NANOSTRUCTURE

#64 | 2021-04-29 βœ… Patent 11,901,172 granted on 2024-02-13
US20210125821A1
Electricity

Method and device for the surface treatment of substrates

#65 | 2021-04-08 βœ… Patent 11,355,374 granted on 2022-06-07
US20210104425A1
Electricity

Accommodating device for retaining wafers

#66 | 2021-03-11 βœ… Patent 11,251,045 granted on 2022-02-15
US20210074544A1
Electricity

Device and method for bonding of substrates

#67 | 2021-03-04 βœ… Patent 11,534,868 granted on 2022-12-27
US20210060710A1
Performing operations; transporting

Device and method for separating a temporarily bonded substrate stack

#68 | 2020-12-24 βœ… Patent 11,348,825 granted on 2022-05-31
US20200402840A1
Electricity

Method and device for surface treatment of substrates

#69 | 2020-10-22 βœ… Patent 10,861,699 granted on 2020-12-08
US20200335341A1
Electricity

Device and method for bonding of substrates

#70 | 2020-10-22 βœ… Patent 11,680,792 granted on 2023-06-20
US20200333136A1
Physics

Incoming runout measurement method

#71 | 2020-09-10 βœ… Patent 11,101,132 granted on 2021-08-24
US20200286733A1
Electricity

Method and device for bonding of substrates

#72 | 2020-07-16 βœ… Patent 10,943,807 granted on 2021-03-09
US20200227299A1
Electricity

Method and device for alignment of substrates

#73 | 2020-07-09 βœ… Patent 10,748,770 granted on 2020-08-18
US20200219726A1
Electricity

Device and method for bonding of substrates

#74 | 2020-06-25 βœ… Patent 10,755,930 granted on 2020-08-25
US20200203165A1
Electricity

Method and device for bonding of substrates

#75 | 2020-06-04 βœ… Patent 11,764,198 granted on 2023-09-19
US20200176437A1
Electricity

Method and device for bonding of chips

#76 | 2020-06-04 βœ… Patent 11,209,739 granted on 2021-12-28
US20200174383A1
Physics

Method and apparatus for aligning two optical subsystems

#77 | 2020-05-28 βœ… Patent 11,315,901 granted on 2022-04-26
US20200168580A1
Electricity

Method for bonding substrates

#78 | 2020-03-19 βœ… Patent 11,460,777 granted on 2022-10-04
US20200089121A1
Physics

Method and device for exposure of photosensitive layer

#79 | 2020-03-05 βœ… Patent 11,040,525 granted on 2021-06-22
US20200070496A1
Performing operations; transporting

Method for embossing micro-structures and/or nano-structures

#80 | 2020-02-27 βœ… Patent 10,636,662 granted on 2020-04-28
US20200066529A1
Electricity

Device and method for bonding of substrates

#81 | 2020-02-20 βœ… Patent 10,954,122 granted on 2021-03-23
US20200055729A1
Performing operations; transporting

Method for bonding of at least three substrates

#82 | 2020-02-13 βœ… Patent 10,906,293 granted on 2021-02-02
US20200047485A1
Performing operations; transporting

Method and device for embossing of a nanostructure

#83 | 2020-01-23 βœ… Patent 10,991,609 granted on 2021-04-27
US20200027768A1
Electricity

Method and substrate holder for the controlled bonding of substrates

#84 | 2020-01-16 βœ… Patent 10,796,944 granted on 2020-10-06
US20200020572A1
Electricity

Method and device for surface treatment of substrates

#85 | 2020-01-09 βœ… Patent 11,024,530 granted on 2021-06-01
US20200013663A1
Electricity

Method for the bonding and debonding of substrates

#86 | 2019-12-26 βœ… Patent 10,971,365 granted on 2021-04-06
US20190393037A1
Electricity

Method and device for bonding substrates

#87 | 2019-12-19 βœ… Patent 11,328,939 granted on 2022-05-10
US20190385870A1
Electricity

Method for prefixing of substrates

#88 | 2019-12-12 βœ… Patent 11,121,091 granted on 2021-09-14
US20190378799A1
Electricity

Method for arranging two substrates

#89 | 2019-12-05 βœ… Patent 11,139,170 granted on 2021-10-05
US20190371607A1
Electricity

Apparatus and method for bonding substrates

#90 | 2019-11-21 βœ… Patent 11,270,902 granted on 2022-03-08
US20190355606A1
Electricity

Electrostatic substrate holder

#91 | 2019-11-21 βœ… Patent 10,994,470 granted on 2021-05-04
US20190351606A1
Performing operations; transporting

Structure stamp, device and method for embossing

#92 | 2019-10-24 βœ… Patent 11,361,980 granted on 2022-06-14
US20190326137A1
Electricity

Device for alignment of two substrates

#93 | 2019-09-26 βœ… Patent 10,852,528 granted on 2020-12-01
US20190293924A1
Physics

Method and device for exposure of photosensitive layer

#94 | 2019-08-08 βœ… Patent 11,282,706 granted on 2022-03-22
US20190244816A1
Electricity

Device and method for bonding of substrates

#95 | 2019-07-25 βœ… Patent 10,964,562 granted on 2021-03-30
US20190228995A1
Electricity

Device and method for bonding of two substrates

#96 | 2019-07-18 βœ… Patent 11,020,953 granted on 2021-06-01
US20190217595A1
Performing operations; transporting

Device and method for bonding substrates

#97 | 2019-07-18 βœ… Patent 11,020,952 granted on 2021-06-01
US20190217594A1
Performing operations; transporting

Device and method for bonding substrates

#98 | 2019-07-11 βœ… Patent 11,020,951 granted on 2021-06-01
US20190210350A1
Performing operations; transporting

Device and method for bonding substrates

#99 | 2019-07-11 βœ… Patent 11,020,950 granted on 2021-06-01
US20190210349A1
Performing operations; transporting

Device and method for bonding substrates

#100 | 2019-07-11 βœ… Patent 11,059,280 granted on 2021-07-13
US20190210348A1
Performing operations; transporting

Device and method for bonding substrates

Also check out EV Group E. Thallner GmbH's (St. Florian am Inn, Austria) applicant profile with 163 patent applications submitted.

AssigneeID:

3552 ⎘