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Inventor profile of:

Kurt Hingerl

City:

Wolfern

Country:

Austria

Published Applications:

Last publication date:

2021-07-01

Top Assignees for applications by Kurt Hingerl

The entities that hold a legal rights for patent applications filed by inventor Hingerl Kurt:

EV GROUP E. THALLNER GMBH 10 St. Florian am Inn, Austria
OSRAM OPTO SEMICONDUCTORS GMBH 1 Regensburg, Germany

Recent patent applications by Hingerl Kurt

Kurt Hingerl from Wolfern, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-07-01

US20210202251A1

Electricity

Method and device for bonding substrates

#2 | 2021-02-04

US20210035934A1

Electricity

Method for producing a connection between component parts

#3 | 2019-12-26

US20190393037A1

Electricity

Method and device for bonding substrates

#4 | 2019-01-03

US20190006313A1

Electricity

METHOD FOR PERMANENT BONDING OF WAFERS

#5 | 2017-08-10

US20170229423A1

Electricity

METHOD FOR PERMANENTLY BONDING WAFERS

#6 | 2016-04-21

US20160111394A1

Electricity

Method for permanent bonding of wafers

#7 | 2015-06-18

US20150165752A1

Performing operations; transporting

METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS

#8 | 2014-06-05

US20140154867A1

Electricity

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation

#9 | 2014-03-13

US20140073112A1

Electricity

Method for permanently bonding wafers

#10 | 2014-02-20

US20140051231A1

Electricity

Method for permanently bonding wafers

#11 | 2014-01-16

US20140017877A1

Electricity

Method for permanently bonding wafers

#12 | 2013-11-14

US20130299080A1

Electricity

Method for permanent bonding of wafers

InventorID:

524206 ⎘