Tempe, Arizona
United States
29
2025-06-12
The entities that hold a legal rights for patent applications filed by inventor Devasenathipathy Shankar:
Shankar Devasenathipathy from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
#2 | 2024-08-22Enhanced base die heat path using through-silicon vias
#3 | 2023-09-14VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR
#4 | 2023-04-27Enhanced base die heat path using through-silicon vias
#5 | 2021-12-02STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
#6 | 2021-08-19Enhanced base die heat path using through-silicon vias
#7 | 2021-08-05Printed heat spreader structures and methods of providing same
#8 | 2021-06-24STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die
#9 | 2021-04-29FILLED LIQUID METAL THERMAL INTERFACE MATERIALS
#10 | 2021-04-08Liquid metal thermal interface material application
#11 | 2020-12-31Socket loading mechanism for passive or active socket and package cooling
#12 | 2020-12-31DEVICE, SYSTEM AND METHOD FOR PROVIDING MICROCHANNELS WITH POROUS SIDEWALL STRUCTURES
#13 | 2020-10-01THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORMANCE
#14 | 2020-09-24Integrated circuit package socket housing to enhance package cooling
#15 | 2020-07-30Cooling solution including microchannel arrays and methods of forming the same
#16 | 2020-06-25Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control
#17 | 2020-06-04DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER MULTI-CHIP PACKAGE (MCP) DICE
#18 | 2020-04-09DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION
#19 | 2020-04-02Integrated heat spreader with multiple channels for multichip packages
#20 | 2020-03-26Sloped metal features for cooling hotspots in stacked-die packages
#21 | 2020-02-27Die back side structures for warpage control
#22 | 2020-02-13Thermal assemblies for multi-chip packages
#23 | 2019-07-11STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
#24 | 2019-02-28Apparatus for inspection of a package assembly with a thermal solution
#25 | 2018-05-24Torque controlled driver apparatus and method
#26 | 2017-01-19High performance transient uniform cooling solution for thermal compression bonding process
#27 | 2016-07-21Thermal compression bonding process cooling manifold
#28 | 2015-06-18Thermal compression bonding process cooling manifold
#29 | 2013-11-14High performance transient uniform cooling solution for thermal compression bonding process
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