AUSTIN, Texas
United States
13
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor SMITH ALAN D.:
ALAN D. SMITH from AUSTIN, US has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT DIE STACK WITH A BACK-SIDE POWER DELIVERY NETWORK
#2 | 2026-03-12DYNAMIC REPARTITION OF MEMORY PHYSICAL ADDRESS MAPPING
#3 | 2025-05-08CHIP PACKAGE WITH ACTIVE SILICON BRIDGE
#4 | 2025-04-10CHIP PACKAGE WITH MULTIPLE HBM STACKS
#5 | 2025-04-10ACCELERATION UNIT WITH MODULAR ARCHITECTURE
#6 | 2025-03-20INTEGRATED MEMORY CONTROLLER CIRCUITRY
#7 | 2024-07-04UNIFIED FLEXIBLE CACHE
#8 | 2024-06-20SYSTEMS AND METHODS FOR CHIPLET SYNCHRONIZATION
#9 | 2024-02-29CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THROUGH-DIE VIAS
#10 | 2023-11-30DYNAMIC REPARTITION OF MEMORY PHYSICAL ADDRESS MAPPING
#11 | 2023-03-30Dynamic repartition of memory physical address mapping
#12 | 2023-01-12Multi-die stacked power delivery
#13 | 2022-02-17Creating interconnects between dies using a cross-over die and through-die vias
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