GABRIEL WONG

City:

MARKHAM

Country:

Canada

Published Applications:

Last publication date:

2025-12-16

Top Assignees for applications by GABRIEL WONG

The entities that hold a legal rights for patent applications filed by inventor WONG GABRIEL:

GABRIEL WONG from MARKHAM, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

Systems and methods for generating a floorplan and bump placement for a package design

CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THROUGH-DIE VIAS

Creating interconnects between dies using a cross-over die and through-die vias

InventorID:

5328606 ⎘